News PCB and advanced packaging design get a makeover with Cadence’s new agentic AI platform 17th July 2026
News Strategic cooperation to focus on developing EU-sovereign rack scale AI compute platform 16th July 2026
News 800V EV innovations are redefining AI data centre power architecture, state market analysts 14th July 2026
News Partners collaborate to address failure analysis and materials characterisation in electronics 10th July 2026
News The Leibniz Institute for High Performance Microelectronics releases first open-source assembly design kit with direct fabrication path 8th July 2026
News Socionext is preparing a high-performance compute chiplet based on TSMC’s A14 process technology 3rd July 2026
News La Luce Cristallina releases beta version of 200mm BaTiO₃ wafer for AI-scale photonics 26th June 2026
PCB and advanced packaging design get a makeover with Cadence’s new agentic AI platform 17th July 2026
Strategic cooperation to focus on developing EU-sovereign rack scale AI compute platform 16th July 2026
800V EV innovations are redefining AI data centre power architecture, state market analysts 14th July 2026
Partners collaborate to address failure analysis and materials characterisation in electronics 10th July 2026
The Leibniz Institute for High Performance Microelectronics releases first open-source assembly design kit with direct fabrication path 8th July 2026
Socionext is preparing a high-performance compute chiplet based on TSMC’s A14 process technology 3rd July 2026
La Luce Cristallina releases beta version of 200mm BaTiO₃ wafer for AI-scale photonics 26th June 2026
