Feature What does the MTBF (Mean Time Between Failures) tell you about a power supply? 4th September 2026
News Design activity to grow in sensing, power and monitoring systems across the automotive sector 19th August 2026
News Leading electronic design automation companies certify their AI-driven offerings on Intel 18A‑P and Intel 14A technologies 28th July 2026
News PCB and advanced packaging design get a makeover with Cadence’s new agentic AI platform 17th July 2026
Events Engineers are invited to apply to review a product of their choosing worth up to £130 from Newark, Farnell or element14 online stores 15th July 2026
News Latest version of Microchip’s Accelerator SDK, VectorBlox 3.0, is aimed at simplifying FPGA based AI implementations 15th July 2026
News 800V EV innovations are redefining AI data centre power architecture, state market analysts 14th July 2026
Design activity to grow in sensing, power and monitoring systems across the automotive sector 19th August 2026
Leading electronic design automation companies certify their AI-driven offerings on Intel 18A‑P and Intel 14A technologies 28th July 2026
PCB and advanced packaging design get a makeover with Cadence’s new agentic AI platform 17th July 2026
Engineers are invited to apply to review a product of their choosing worth up to £130 from Newark, Farnell or element14 online stores 15th July 2026
Latest version of Microchip’s Accelerator SDK, VectorBlox 3.0, is aimed at simplifying FPGA based AI implementations 15th July 2026
800V EV innovations are redefining AI data centre power architecture, state market analysts 14th July 2026
