Electronics World - Electronic Engineering and Design - Electronics World

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Products

Rev 2.0 PolarFire FPGA Ethernet sensor bridge by Microchip advances Edge AI sensor connectivity

Microchip Technology has released Revision 2.0 of its PolarFire FPGA Ethernet Sensor Bridge, a significantly smaller, production-ready board for standardized sensor integration leveraging NVIDIA Holoscan Sensor

EMI powerline filters for protecting equipment against high-altitude electromagnetic pulse events

12th August 2026

EMC solutions provider EMIS now offers a range of EMI powerline filters designed to protect sensitive electrical and electronic equipment against High-Altitude Electromagnetic Pulse (HEMP)

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Products

EAO launches Highland brand with new cost-effective cooling solutions

11th August 2026

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Feature

Using GaN FET models in LTspice simulations

10th August 2026

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Products

Lane Electronics now stocks the newly released Cinch-Fibreco JCON series adapter

10th August 2026

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Products

High-pressure pH/ORP sensor has been designed for harsh process conditions

7th August 2026

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News

KIOXIA starts shipping samples of its 9th-generation BiCS FLASH 1Tb triple-level cell memory devices

6th August 2026

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Products

A new series of infrared receiver modules for remote control

6th August 2026

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Products

A purpose-built interconnect platform for humanoid robotics

6th August 2026

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News

EnSilica joins European 5G‑aNTeNna consortium to advance Ka‑band 5G‑NTN satellite user terminals

5th August 2026

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Products

IP-rated pole-mount plastic enclosures for IoT/IIoT

5th August 2026

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Advertorial

Memory bottleneck puts IoT module supply under pressure as Astute Group adds REYAX

5th August 2026

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News

Sony accounts for almost half of global CMOS image sensor revenues

4th August 2026

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News

FRAMOS integrates optics, calibration, ISP tuning and manufacturing into a single development workflow

4th August 2026

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Feature

Rise of the neoclouds

3rd August 2026

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News

Sensor technology firm, SICK, has equipped its Nova machine vision platform with AI

3rd August 2026

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Feature

Manufacturers are addressing PCB material shortages created by AI

31st July 2026

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News

Chinese T&M equipment maker opens facilities in Germany

31st July 2026

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Products

Renesas’s third-generation DDR5 multiplexed rank dual in‑line memory module provides higher memory bandwidth

30th July 2026

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Products

Southco’s new battery-operated Bluetooth controller delivers long operation life with little maintenance

30th July 2026

Products

Electronics World’s selection of products, from components to systems, software, platforms and tools, and much more

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News

Rev 2.0 PolarFire FPGA Ethernet sensor bridge by Microchip advances Edge AI sensor connectivity

12th August 2026

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Industrial Electronics

EMI powerline filters for protecting equipment against high-altitude electromagnetic pulse events

12th August 2026

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News

Connector sales are down by 13% but orders are up 8%, reports ITSA

11th August 2026

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News

EAO launches Highland brand with new cost-effective cooling solutions

11th August 2026

Design

Tutorial- and how-to type articles prepared by engineers for engineers, to help tackle design issues

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Feature

Using GaN FET models in LTspice simulations

10th August 2026

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Feature

Rise of the neoclouds

3rd August 2026

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News

Leading electronic design automation companies certify their AI-driven offerings on Intel 18A‑P and Intel 14A technologies

28th July 2026

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Feature

Java is the strongest enabler for adopting agentic AI

20th July 2026

Events

A comprehensive guide to trade shows, exhibitions, webinars, industry awards and other events in the electronics industry

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Events

Engineers are invited to apply to review a product of their choosing worth up to £130 from Newark, Farnell or element14 online stores

15th July 2026

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Sponsored

ODU docking solutions – Individuality meets longevity

1st July 2026

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News

Thintronics named winner of Junkosha’s Technology Innovator of the Year Category

26th June 2026

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News

Acbel will show its EV power solutions at Power2Drive Europe 2026

23rd June 2026

Business

Merger and acquisitions, co-operations, joint developments, key executive moves and other announcements that move the electronics industry forward

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News

Connector sales are down by 13% but orders are up 8%, reports ITSA

11th August 2026

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News

EnSilica joins European 5G‑aNTeNna consortium to advance Ka‑band 5G‑NTN satellite user terminals

5th August 2026

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News

Sony accounts for almost half of global CMOS image sensor revenues

4th August 2026

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Feature

Rise of the neoclouds

3rd August 2026

Applications

From automotive and medical to consumer and industrial electronics, we address the places where electronics is being used

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Products

A purpose-built interconnect platform for humanoid robotics

6th August 2026

Screenshot 2026 08 05 093804 Electronics World - Electronic Engineering and Design

Products

IP-rated pole-mount plastic enclosures for IoT/IIoT

5th August 2026

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News

Research finds a glaring gap between data centres’ rapid sector growth and its maintenance, repair and operations strategies

28th July 2026

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Products

Yokogawa Test & Measurement introduces a high-precision power analyzer, WT1500

28th July 2026

Research & Development

Cutting-edge developments by industry and academia

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News

EnSilica joins European 5G‑aNTeNna consortium to advance Ka‑band 5G‑NTN satellite user terminals

5th August 2026

Screenshot 2026 08 04 095902 Electronics World - Electronic Engineering and Design

News

Sony accounts for almost half of global CMOS image sensor revenues

4th August 2026

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News

“Thousands of new satellites, there should be zero room for error,” says IEEE senior member

29th July 2026

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News

Ispace-EUROPE has won a €65m ESA contract to take Europe’s first lunar polar ice exploration rover to the Moon

27th July 2026

Students' Corner

A section about student activities and learning in the field of electronics

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Feature

Using GaN FET models in LTspice simulations

10th August 2026

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Feature

Java is the strongest enabler for adopting agentic AI

20th July 2026

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News

The Leibniz Institute for High Performance Microelectronics releases first open-source assembly design kit with direct fabrication path

8th July 2026

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News

Lancaster-based electronics firm launches initiative to help young people access skilled careers

24th June 2026