News EnSilica joins European 5G‑aNTeNna consortium to advance Ka‑band 5G‑NTN satellite user terminals 5th August 2026
News “Thousands of new satellites, there should be zero room for error,” says IEEE senior member 29th July 2026
News Ispace-EUROPE has won a €65m ESA contract to take Europe’s first lunar polar ice exploration rover to the Moon 27th July 2026
News Strategic cooperation to focus on developing EU-sovereign rack scale AI compute platform 16th July 2026
News The Leibniz Institute for High Performance Microelectronics releases first open-source assembly design kit with direct fabrication path 8th July 2026
News La Luce Cristallina releases beta version of 200mm BaTiO₃ wafer for AI-scale photonics 26th June 2026
News Thintronics named winner of Junkosha’s Technology Innovator of the Year Category 26th June 2026
News Fraunhofer IPMS unveils a quantum random number generator for greater security of applications 17th June 2026
EnSilica joins European 5G‑aNTeNna consortium to advance Ka‑band 5G‑NTN satellite user terminals 5th August 2026
“Thousands of new satellites, there should be zero room for error,” says IEEE senior member 29th July 2026
Ispace-EUROPE has won a €65m ESA contract to take Europe’s first lunar polar ice exploration rover to the Moon 27th July 2026
Strategic cooperation to focus on developing EU-sovereign rack scale AI compute platform 16th July 2026
The Leibniz Institute for High Performance Microelectronics releases first open-source assembly design kit with direct fabrication path 8th July 2026
La Luce Cristallina releases beta version of 200mm BaTiO₃ wafer for AI-scale photonics 26th June 2026
Fraunhofer IPMS unveils a quantum random number generator for greater security of applications 17th June 2026
