Cadence promises to take designers from system planning to final product in a single AI-native environment with its newly introduced AuraStack AI Super Agent – an agentic AI platform for printed circuit board (PCB) and advanced packaging design. 

Running on Allegro AI Studio, Cadence claims the AuraStack AI Super Agent halves the time to market, with a 15 time gain in productivity.

“As hyperscale data centres deploy massive AI clusters and other industries advance increasingly intelligent, high-performance systems, engineering teams face growing complexity in PCB and advanced package design. Agentic AI orchestration, combined with trusted EDA and SDA tools, enables customers to move from manual iteration to intelligent, automated design realisation,” said Michael Jackson, corporate vice president of R&D for System Design and Analysis at Cadence. “The next era of AI infrastructure, spanning data centres, automotive, aerospace and physical AI will be defined not only by silicon, but by the systems that connect, power and cool it.”

The Cadence AuraStack AI Super Agent is accelerated by NVIDIA Blackwell and NVIDIA CUDA-X. It coordinates domain-specific AI agents across planning, implementation and tightly integrated multiphysics analysis domains to compress the system-design cycle through manufacturing.

Building on the same architecture as Cadence’s ChipStack AI Super Agent, agentic AI is combined with principled simulation and optimisation tools, leveraging a mental model of the design intent, to automate and orchestrate the design exploration, realisation and signoff. The AuraStack AI Super Agent brings together automation and optimisation for system planning, constraints management, physical structure definition, IP creation and reuse, place and route, design for manufacturability and multiphysics analysis across Cadence’s system design and analysis portfolio. It introduces a unified, AI-driven multiphysics foundation that concurrently models and optimises electrical, thermal and mechanical behavior – including SI/PI, thermal, mechanical stress, drop, vibration and fatigue analysis — within a closed-loop environment, enabling earlier tradeoff evaluation and product-level optimisation across the entire design flow. This continuous multiphysics feedback loop enables real-time design convergence, reducing late-stage surprises and improving overall system reliability.

With the AuraStack AI Super Agent, Cadence boasts that it is the only provider with agentic AI solutions spanning the full electronic system design flow, from digital and analogue silicon design, advanced packaging, through to PCB design, building on its ChipStack, InnoStack and ViraStack AI Super Agents.