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Merger and acquisitions, co-operations, joint developments, key executive moves and other announcements that move the electronics industry forward

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ODU enables DEIF with its connectors to fully automate end-of-line testing

9th June 2026

News

Peridio’s Avocado OS is now added to SolidRun’s AI platforms

8th June 2026

News

Infineon and Siemens are partnering to advance electrical protection in data centres

8th June 2026

News

Semiconductor equipment billings increased 14% YoY in Q1 2026, states report

5th June 2026

News

Farnell responds to growing EMEA demand for drones in various sectors

5th June 2026

News

Analog Devices confirms commitment to the MGX architecture with power solutions

4th June 2026

News

UL-aligned reference architecture developed by Siemens, NVIDIA and Fluence

2nd June 2026

News

Automaker to use Snapdragon Digital Chassis in its next-generation vehicle architectures

22nd May 2026

News

Partners validate wafer exchange for ferroelectric memory materials within the FAMES pilot line

20th May 2026

News

TDK to present “The power in your design” lineup of products at PCIM this year

19th May 2026

Feature

Memory shortages, Nexperia supply chain crisis, and AI – the world of electronics parts as it is now

18th May 2026

News

CP Automation expands UPS range with compact Lithium battery options

15th May 2026

ODU enables DEIF with its connectors to fully automate end-of-line testing

9th June 2026

Peridio’s Avocado OS is now added to SolidRun’s AI platforms

8th June 2026

Infineon and Siemens are partnering to advance electrical protection in data centres

8th June 2026

Semiconductor equipment billings increased 14% YoY in Q1 2026, states report

5th June 2026

Farnell responds to growing EMEA demand for drones in various sectors

5th June 2026

Analog Devices confirms commitment to the MGX architecture with power solutions

4th June 2026

UL-aligned reference architecture developed by Siemens, NVIDIA and Fluence

2nd June 2026

Automaker to use Snapdragon Digital Chassis in its next-generation vehicle architectures

22nd May 2026

Partners validate wafer exchange for ferroelectric memory materials within the FAMES pilot line

20th May 2026

TDK to present “The power in your design” lineup of products at PCIM this year

19th May 2026

Memory shortages, Nexperia supply chain crisis, and AI – the world of electronics parts as it is now

18th May 2026

CP Automation expands UPS range with compact Lithium battery options

15th May 2026

Business

ODU enables DEIF with its connectors to fully automate end-of-line testing

Peridio’s Avocado OS is now added to SolidRun’s AI platforms

Infineon and Siemens are partnering to advance electrical protection in data centres

Semiconductor equipment billings increased 14% YoY in Q1 2026, states report

Farnell responds to growing EMEA demand for drones in various sectors

Analog Devices confirms commitment to the MGX architecture with power solutions

UL-aligned reference architecture developed by Siemens, NVIDIA and Fluence

Automaker to use Snapdragon Digital Chassis in its next-generation vehicle architectures

Partners validate wafer exchange for ferroelectric memory materials within the FAMES pilot line

TDK to present “The power in your design” lineup of products at PCIM this year

Memory shortages, Nexperia supply chain crisis, and AI – the world of electronics parts as it is now

CP Automation expands UPS range with compact Lithium battery options

ODU enables DEIF with its connectors to fully automate end-of-line testing

Peridio’s Avocado OS is now added to SolidRun’s AI platforms

Infineon and Siemens are partnering to advance electrical protection in data centres

Semiconductor equipment billings increased 14% YoY in Q1 2026, states report

Farnell responds to growing EMEA demand for drones in various sectors

Analog Devices confirms commitment to the MGX architecture with power solutions

UL-aligned reference architecture developed by Siemens, NVIDIA and Fluence

Automaker to use Snapdragon Digital Chassis in its next-generation vehicle architectures

Partners validate wafer exchange for ferroelectric memory materials within the FAMES pilot line

TDK to present “The power in your design” lineup of products at PCIM this year

Memory shortages, Nexperia supply chain crisis, and AI – the world of electronics parts as it is now

CP Automation expands UPS range with compact Lithium battery options

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