Socionext is preparing a high-performance compute chiplet in TSMC’s A14 process technology, planning a tape out this September.
The chip will serve as a technology platform to validate CPU and xPU architectures for scalability, on leading-edge process technology, supporting customer programs in AI hyperscale data centres and other high-performance, compute-intensive applications.
The device will integrate compute chiplets designed for high-performance and power efficiency. The program aims to accelerate the development of production SoCs tailored to AI/xPU infrastructure applications.
Socionext’s engagement with TSMC builds on the company’s long-standing expertise in leading-edge silicon design, encompassing multi-core CPU and xPU architectures in advanced process technologies for complex SoCs targeting enterprise and data center applications.
Socionext is engaging with customers planning to adopt TSMC’s A14 process to develop high-performance and power-efficient AI SoCs targeting the data centre infrastructure buildout. These engagements exemplify Socionext’s ongoing commitment to leading-edge technologies such as A14 to enable flawless execution for our customers and provide them with the fastest time-to-market for the most advanced products.
