News Automaker to use Snapdragon Digital Chassis in its next-generation vehicle architectures 22nd May 2026
News Partners validate wafer exchange for ferroelectric memory materials within the FAMES pilot line 20th May 2026
Feature Memory shortages, Nexperia supply chain crisis, and AI – the world of electronics parts as it is now 18th May 2026
News Astute Group and Redler Technologies announce strategic distribution partnership for UK and Europe 15th May 2026
News Raman analytical spectroscopy instrument to go to the Moon thanks to a team of universities 13th May 2026
Advertorial Astute to show several of its clients’ products on its stand at Hardware Pioneers Max 2026 13th May 2026
News Aeva adopts Cadence Tensilica Vision DSPs to advance its LiDAR products’ performance and efficiency 12th May 2026
News Q5D and Kyocera AVX expand collaboration with custom IDC connectors for automated wire harness assembly 8th May 2026
Automaker to use Snapdragon Digital Chassis in its next-generation vehicle architectures 22nd May 2026
Partners validate wafer exchange for ferroelectric memory materials within the FAMES pilot line 20th May 2026
Memory shortages, Nexperia supply chain crisis, and AI – the world of electronics parts as it is now 18th May 2026
Astute Group and Redler Technologies announce strategic distribution partnership for UK and Europe 15th May 2026
Raman analytical spectroscopy instrument to go to the Moon thanks to a team of universities 13th May 2026
Astute to show several of its clients’ products on its stand at Hardware Pioneers Max 2026 13th May 2026
Aeva adopts Cadence Tensilica Vision DSPs to advance its LiDAR products’ performance and efficiency 12th May 2026
Q5D and Kyocera AVX expand collaboration with custom IDC connectors for automated wire harness assembly 8th May 2026