News Leading electronic design automation companies certify their AI-driven offerings on Intel 18A‑P and Intel 14A technologies 28th July 2026
News PCB and advanced packaging design get a makeover with Cadence’s new agentic AI platform 17th July 2026
News Latest version of Microchip’s Accelerator SDK, VectorBlox 3.0, is aimed at simplifying FPGA based AI implementations 15th July 2026
News Partners collaborate to address failure analysis and materials characterisation in electronics 10th July 2026
News The Leibniz Institute for High Performance Microelectronics releases first open-source assembly design kit with direct fabrication path 8th July 2026
News Renesas acquires Pictorus for its platform, to offer engineers a more visual experience, with no need to write code 18th June 2026
News Nova and Microchip jointly prepare a validated battery management reference platform 18th June 2026
News Cadence now integrates Nvidia’s accelerated computing stack in its agentic AI solutions portfolio 18th March 2026
Products Sandisk releases new open-source tool for managing data storage bottlenecks 5th February 2026
Leading electronic design automation companies certify their AI-driven offerings on Intel 18A‑P and Intel 14A technologies 28th July 2026
PCB and advanced packaging design get a makeover with Cadence’s new agentic AI platform 17th July 2026
Latest version of Microchip’s Accelerator SDK, VectorBlox 3.0, is aimed at simplifying FPGA based AI implementations 15th July 2026
Partners collaborate to address failure analysis and materials characterisation in electronics 10th July 2026
The Leibniz Institute for High Performance Microelectronics releases first open-source assembly design kit with direct fabrication path 8th July 2026
Renesas acquires Pictorus for its platform, to offer engineers a more visual experience, with no need to write code 18th June 2026
Cadence now integrates Nvidia’s accelerated computing stack in its agentic AI solutions portfolio 18th March 2026
