News Leading electronic design automation companies certify their AI-driven offerings on Intel 18A‑P and Intel 14A technologies 28th July 2026
News PCB and advanced packaging design get a makeover with Cadence’s new agentic AI platform 17th July 2026
News Aeva adopts Cadence Tensilica Vision DSPs to advance its LiDAR products’ performance and efficiency 12th May 2026
News Cadence now integrates Nvidia’s accelerated computing stack in its agentic AI solutions portfolio 18th March 2026
News Cadence pushes the boundaries of chip design and verification with its AI-powered super agent, ChipStack 11th February 2026
Leading electronic design automation companies certify their AI-driven offerings on Intel 18A‑P and Intel 14A technologies 28th July 2026
PCB and advanced packaging design get a makeover with Cadence’s new agentic AI platform 17th July 2026
Aeva adopts Cadence Tensilica Vision DSPs to advance its LiDAR products’ performance and efficiency 12th May 2026
Cadence now integrates Nvidia’s accelerated computing stack in its agentic AI solutions portfolio 18th March 2026
Cadence pushes the boundaries of chip design and verification with its AI-powered super agent, ChipStack 11th February 2026
