June 2021

From this Issue...

Figure 1 Verification requirements for SystemC/C++ designs
Verification requirements for SystemC/C++ designs

Although SystemC/C++ coding styles have been used for many years, specific models  have recently emerged to drive common design flows across engineering teams. These include abstract algorithmic design code as input for high-level synthesis (HLS) tools, virtual platform models for early software test, configurable intellectual property (IP) blocks, and many more.

Screenshot 1 3 The strength of wide bandgap materials for power electronics
The strength of wide bandgap materials for power electronics

Regularly found in power electronics today are semiconductor materials are the so-called wide-bandgap (WBG) materials, Silicon Carbide (SiC) and Gallium Nitride (GaN).

1shutterbouy photography avbzONO06xM unsplash SGS reviews drone regulations and standards for manufacturers
SGS reviews drone regulations and standards for manufacturers

New legislation comes at a time when drones are becoming commonplace: a home delivery company made the news with its trialing of drone deliveries in the UK.

Panthronics PTX100R Evalboard Fig 1b Easing the design of NFC radio circuits
Easing the design of NFC radio circuits

The EMVCo 3.0 standard applies a comprehensive set of specifications covering both, analogue operations (the physical coupling between the card device and the terminal) and digital operations (the NFC protocol layer and payments application layer).

A151054 238343 fig 01 Synchronising multiple ADCs with JESD204B
Synchronising multiple ADCs with JESD204B

By Ian Beavers, Applications Engineer, Analog Devices Many communications, instrumentation and signal-acquisition systems must be able to simultaneously sample analogue input signals across multiple analogue-to-digital converters (ADCs). The sampled da …

1image Radiative solution keeps wearable devices cool, even in sunlight
Radiative solution keeps wearable devices cool, even in sunlight

Korean and American scientists have developed an innovative solution to combat heat in wearable sensors.

1im Winbond HyperRAM and SpiStack and Renesas RZ/A2M accelerate the construction of embedded artificial intelligence (AI) systems
Winbond HyperRAM and SpiStack and Renesas RZ/A2M accelerate the construction of embedded artificial intelligence (AI) systems

Customers of the RZ/A2M can benefit from Winbond’s long-term supply for various types of external memory, including DRAM, NOR Flash, and NAND Flash which are currently the mainstream of embedded systems.

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