STMicroelectronics launched a new, compact direct Time-of-Flight (ToF) 3D LiDAR all-in-one module, the VL53L9. ST believes its latest module sets a new benchmark in high-resolution sensing in a compact and cost-effective package. It promises to deliver AI-ready output data for low-compute edge AI systems on small MCUs and high-performance sensing across a wide range of applications across robotics, industrial automation, smart buildings, AR/VR, and healthcare.
“VL53L9 demonstrates how far Time-of-Flight sensing has evolved, combining high-resolution depth data, up to 100 frames per second, and a fully integrated architecture in a single compact module. By simplifying integration and reducing system complexity, we enable customers to accelerate the development of applications such as robotics, smart infrastructure, and healthcare monitoring,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics.
This launch also reflects ST’s strategy to move beyond standalone sensors and deliver integrated sensing systems for edge AI applications.
“Three-dimensional sensing demand has accelerated across robotics, industrial automation, XR and intelligent consumer devices. Time-of-Flight technology is expanding beyond smartphones into applications requiring compact, affordable, and precise depth perception, from navigation and people monitoring to gesture recognition and safety. Higher resolution multi-zone dToF modules are now emerging as key enablers for this next wave of 3D sensing adoption,” said Anas Chalak, Market & Technology Analyst at Yole Group.
Being all in one module, the VL53L9 integrates the dToF processing, with a dedicated power management IC.
The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. This greatly simplifies post-processing. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity.
The devices will enter production in early July 2026.
