Connector supplier, Samtec, has expanded its product family of mPOWER ultra micro power interconnects with vertical board connectors (UMPS, UMPT) and right-angle board connectors (UMPT-RA) in through-hole board termination options. This provides enhanced mechanical robustness often required in harsh industrial, military, and aerospace applications. Connector designs using surface mount technology are also available.
Designed for power density, mPOWER ultra micro connectors offer a 40% space savings over conventional power connectors. Their compact form factor supports up to 18 A per power blade, enabling reliable high current performance without sacrificing board space.
In addition to power density, mPOWER interconnects provide design flexibility across board-to-board, wire-to-board, and wire-to-wire applications. System design is simplified through a range of options, including vertical and right-angle configurations, stack heights from 5 mm to 20 mm, rugged latching features, and 2 to 10 power positions. PVC or Teflon® fluoropolymer cable assemblies are available in multiple wire gauges to support varying application needs.
To simplify the design process, Samtec’s mPOWER connectors are accompanied by free access to design resources such as prints, models, and test reports.
