Molex will showcase its latest thermal management innovations at Computex 2026 (booth M1330, 4F. TAINEX 1), led by the debut of the new Multi-Channel Liquid Cooled Busbars. As intensive AI workloads drive rack power requirements toward the 1-megawatt (MW) threshold, traditional air-cooled infrastructure has hit a physical limit. Molex bridges this “AI Thermal Gap” by extending liquid cooling into the power-distribution layer, supporting currents up to 15,000 Amps today with a strategic design roadmap to 25,000 Amps.
“Direct-to-chip cooling is now standard for compute, but for AI to truly scale, we must also address the thermal challenges of the power path,” said Kevin Alberts, VP and GM of the Power and Signal Business Unit (PSBU), Molex. “By integrating liquid cooling into the power backbone with our new Multi-Channel Liquid Cooled Busbars, Molex enables customers to maintain stable electrical performance and reduce thermal stress without drastically increasing the physical footprint of the rack.”
Unlike conventional liquid cooled designs that use a single-channel fluid path, Molex has engineered a unique multi-channel architecture that segments the coolant path into as many as seven discrete channels. This approach not only facilitates more uniform and efficient heat extractions to reduce hot spots and thermal stress, but it also improves electrical performance stability at high currents. As a result, the Molex Multi-Channel Liquid Cooled Busbars deliver a major benchmark for thermal efficiency: a 15°C T-Rise at 15,000 Amps.
According to data simulations conducted by Molex, the seven-channel Multi-Channel Liquid Cooled Busbar architecture yields up to 20% greater cooling efficiency when compared to a single-channel design. The ability to maximize heat extraction within the same mechanical footprint gives data center architects the ability to scale power without sacrificing valuable rack space.
The new busbars can be tailored in length, depth and fluid inlet/outlet points to accommodate various layouts. This flexibility, combined with a standard plug-and-play interface, allows for a seamless transition to liquid cooling without requiring a redesign of the rack infrastructure.
