Connectivity company, Molex, has launched its Impress co-packaged copper solutions to meet the needs of next-generation data centres and AI workflows, enabling high-speed data transmission and exceptional signal integrity. Impress provides a compression-based, substrate connector and mating cable assembly that supports data rates up to 224Gbps PAM-4, and beyond.
The Impress solutions provide the connection point directly onto the ASIC package substrate, making them a versatile, two-piece connector system that further shrinks the distance signals must travel through the PCB. The result is a finely tuned, full-channel solution with complete isolation from the substrate to the interconnect, reducing signal loss and crosstalk.
“As AI workloads push data centres to their physical limits, we are focused on maximising efficiency without sacrificing signal integrity. Impress is our latest innovation built to help scale infrastructures without exponential increases in power consumption or cost. By enabling high performance at the rack level, Molex is making next-generation compute more technically and economically viable,” said Jairo Guerrero, VP & GM, Copper Solutions, Molex.
The Impress socket is compression-attached to the substrate, preventing damage to this delicate and expensive layer while simplifying rework, maintenance and upgrades. Impress has been built to ensure rugged and reliable performance, featuring over-moulded cable strain relief and a mechanical contact wipe feature to reinforce long-term mating durability and operational lifecycles.
The Impress Co-Packaged Copper solutions also ensure scaleable density, efficient power distribution and robust performance in a compact form factor that is designed to improve signal reliability, reduce downtime and enhance overall system flexibility.
Development work is underway to validate Impress Co-Packaged Copper Solutions for use with 336G and 448G applications.
