Imagination Technologies is bringing its latest functionally-safe GPU IP to the European CHASSIS programme’s new Automotive Base Die. This 5nm chiplet project is laying the foundation for the open and standardised chiplet ecosystem that is crucial for the next generation of software-defined vehicles.
Its DXS GPU IPbe applied to automotive graphics and compute. This is an ASIL-B certified solution that allows OEMs to introduce next-generation graphics-rich in-vehicle infotainment and cockpit workloads. It can also act as a flexible co-processor for AI-related tasks.
“Chiplets are reshaping automotive compute,” said Markus Mosen, Chief Executive Officer, Imagination Technologies. “By contributing to the Automotive Base Die, Imagination is ensuring that the open chiplet ecosystem can deliver the responsive displays and in-vehicle entertainment that OEMs want in their next generation of cars.”
The Automotive Base Die acts as the central communication and integration hub for automotive System-on-Chip (SoC) infrastructure, designed to enable seamless integration of third-party chiplets via the Universal Chiplet Interconnect Express (UCIe) standard. This initiative, funded within the Chips-JU program CHASSIS by leading European entities BMW, imec and Bosch, aims to foster unprecedented flexibility and innovation in the automotive industry.
The CHASSIS program, coordinated by Bosch, is a three-year European research project focused on creating an open chiplet ecosystem for secure and scalable technology in software-defined mobility. The Automotive Base Die represents a significant step towards CHASSIS’s goal of establishing a standardized, open chiplet-based platform that will drive competition and foster innovation across the industry.
By enabling early interoperability testing with other chiplets and accelerating European-centric design, the Automotive Base Die is poised to strengthen Europe’s position in advanced semiconductor design and manufacturing, while fostering a more agile and innovative automotive supply chain.
CHASSIS receives funding within the Chips Joint Undertaking (Chips JU) and National Authorities.
