To help satellite OEMs to streamline their system development work, as well as reducing the time and engineering effort involved, Teledyne e2v and Texas Instruments (TI) collaborated on a new radiation-tolerant DDR4 modular platform. This field-proven hardware consists of a 4GB/8GB capacity DDR4T0xG72 DDR4 memory from Teledyne e2v accompanied by a TI TPS7H3301-SP DDR termination low drop-out (LDO) voltage regulator that provides a stable supply for the DDR4 module.

Optimized for implementations where there are acute size, weight and power (SWaP) constraints to factor in, the DDR4/TPS7H3301-SP platform is very compact and convenient to use. The constituent components have already gone through comprehensive space characterisation and qualification procedures to help designers achieve long-term operation without single event latch-up (SEL) and single event upset (SEU) issues arising.

This platform allows elevated levels of data storage capacity to be achieved inside a very small form factor. It requires three times less PCB area versus solutions from the competition, and its volume is smaller by a factor of ten.
Versatility is another plus point, with the DDR4T0xG72/TPS7H3301-SP modular platform being applicable across a wide range of space-grade processors (including Teledyne e2v and others), FPGAs/ACAPs (such as AMD/Xilinx, Microchip, NanoXplore, etc.) and custom-built ASICs.