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Hensoldt and Nano Dimension assemble the world’s first 10-layer 3D-printed PCB

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Using a newly-developed dielectric polymer ink and conductive ink from Nano Dimension, Hensoldt assembled the world’s first 10-layer printed circuit board (PCB), populated with high-performance electronics soldered on both sides of the structure. Until now, 3D printed boards could not bear the soldering process necessary for two-sided population of components.

“To have high-density components quickly available with reduced effort by means of 3D printing gives us a competitive edge in the development process of such high-end electronic systems,” said Hensoldt CEO, Thomas Müller.

“Nano Dimension’s relationship with Hensoldt is the type of partnership with customers we are striving for,” commented Yoav Stern, Nano Dimension President & CEO. “Working together and learning from Hensoldt led us to reach a first-of-its-kind in-depth knowledge of polymer materials applications. Additionally, it guided us in the development of Hi-PEDs (High Performance Electronic Device) that create competitive edges by enabling unique implementations with shortest time to market.”

Additively manufactured electronics, or AME, is a highly agile and individual engineering methodology to prototype a new electronic circuitry. With it, new design and functionality of specialised electronic components can be verified prior to production, leading to significant reduction of time and cost in the development process. Furthermore, AME gives a verified and approved design before production starts, leading to higher quality of the final product.

Hensoldt started working with Nano Dimension’s DragonFly 3D printing system in 2016, to examine the possibilities of 3D printing electronics. Last year, Hensoldt successfully implemented the DragonFly Lights-Out Digital Manufacturing (LDM) printing technology, the industry’s only additive manufacturing platform for round-the-clock 3D printing of electronic circuitry.

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