Microsemi Corporation announced that its field programmable gate arrays (FPGAs) and SmartFusion customizable system-on-chip (cSoC) solutions are now characterized at extreme operating temperatures ranging from 150 degrees Celsius to 200 degrees Celsius.
The devices have already been deployed in down-hole drilling products, space systems, avionics equipment and other applications requiring high performance and the utmost reliability in extreme low and high temperature environments.
“Components that are capable of highly reliable operation in extreme hot and cold temperatures are essential for oil exploration applications, aerospace and defense equipment, and other products used in harsh operating environments,” said Paul Ekas, vice president of marketing for Microsemi’s SoC product group. “Our new extreme temperature solutions demonstrate our continued commitment to delivering consistently high quality solutions that address tough industry challenges.”
The following Microsemi products are now available in extreme operating temperature ranges: (see table attached)
