PerkinElmer and Covalent are joining their expertise to address the growing complexity of failure analysis and materials characterisation.
In electronics, semiconductor manufacturing, energy storage and other precision-materials industries, identifying the root causes of material failures and performance drops is essential. Component degradation, trace chemical contamination, and structural breakdowns require highly sensitive analytical tools capable of detecting the smallest indicators of a larger problem.
The two companies will provide advanced analytical instrumentation and analysis services that will tackle these concerns, by utilising Inductively Coupled Plasma Mass Spectrometry (ICP-MS/MS) and Liquid Chromatography-Tandem Mass Spectrometry (LC-MS/MS). This way, researchers and manufacturers can track down ultra-trace elemental impurities and organic degradation mechanisms, optimising manufacturing quality control and accelerate root-cause failure analysis.
“This is an important partnership to help us better understand the analysis challenges facing the semiconductor, electronics, and battery industries,” said Paul Davies, Vice President, North America, PerkinElmer. “Covalent is a well-respected subject matter expert in this space and will be an invaluable voice of the customer, helping us push the boundaries of what ICP-MS/MS, LC-MS/MS, and other technologies in our portfolio are capable of in failure analysis, raw material characterisation, and battery lifetime diagnostics.”
“As materials systems and product designs become more complex, the ability to combine cutting-edge instrumentation with expert application knowledge is more important than ever. Our partnership with PerkinElmer will help customers gain deeper insight into the mechanisms that drive performance and reliability,” added Craig Hunter, Covalent CEO.
PerkinElmer’s ICP-MS/MS delivers unmatched sensitivity for ultra-trace chemical analysis of metallic impurities before they deposit on silicon or compound-silicon wafers. The technique can also characterize the corrosion, solder joint deterioration, and migratory short-circuiting that cause modern printed circuit boards and electronic packages to fail.
