Winbond Electronics launched a new version of its QspiNAND Flash device specifically for use with the Qualcomm 9205 LTE modem.
The industry’s first 1.8V, 512Mbits (64Megabyte) QspiNAND Flash meets the right density requirements of the new generation cellular narrowband (NB) IoT modules.
“As the Internet of Things expands to 50 billion connected devices by 2020, Quad SPI-NAND adoption rate may increase 4-5 fold within a few years,” said Alan Niebel, president of WebFeet Research, an independent market-research firm.
Winbond expands its reach from traditional QSPI-NOR Flash to QSPI-NAND Flash, giving customers the flexibility to choose their Code Storage Feature-Set to expand with minimal cost. This is done by using the same 6-pin signals and QSPI command-set for SLC NAND Flash densities without compromising performance by utilizing the new Continuous READ feature at 104MHz Read Speed.
“Expanding the SpiFlash family to include QspiNAND Flash will benefit the NOR market and SLC NAND Flash conversion from both QSPI-NOR Flash and Parallel NAND Flash,” said J.W. Park, Technology Executive of Winbond Flash Memory. “Winbond jointly-developed this new 512Mb QspiNAND Flash with Baseband Engineering-Team in delivering high performance with cost-benefit in mind.”
W25N QspiNAND Flash family devices are offered in space-saving 8-pin packages which was not possible in the past for typical SLC NAND Flash memory. W25N512GW is a 512M-bit memory array organized into 32,768 programmable pages of 2,112 bytes each. W25N512GW provides a new Continuous Read mode that allows for efficient access to the entire memory array with a single Read command that is ideal for code shadowing applications.
Clock speeds of 104MHz allow equivalent 416MHz (104MHz x 4) speed for Quad I/O performance when using the Fast Read Dual/Quad I/O instructions. To provide better NAND Flash memory manageability, an on-chip feature is provided to perform bad block management.
To ensure meeting the growing global demand for high-volume solutions, Winbond QspiNAND Flash memories are manufactured in the company’s 12-inch wafer fabrication facility in Taichung, Taiwan. Winbond is expanding capacity to meet and to ensure support for new business growth anticipated in both Automotive and IoT Segments.