Tsing Micro has launched a new artificial intelligence (AI) system-on-chip (SoC) and Winbond Electronics it’s supplying its high-performance, low-power 1Gb LPDDR3 DRAM product to it.
Beijing, China-based Tsing Micro’s TX510 SoC is a highly-advanced AI edge computing engine optimised for functions such as 3D sensing and face , object and gesture recognition. Paired with Winbond’s LPDDR3 DRAM, which offers maximum bandwidth of 1866Mb/s and operates from a dual 1.2V/1.8V supply, the TX510 offers outstanding speed and accuracy in AI imaging applications.
Tsing Micro has implemented an innovative architecture in the TX510 SoC: it includes a 32-bit RISC processor, a reconfigurable neural network engine, a reconfigurable general computing engine, an image signal processor and a 3D sensing engine. For shipping to customers, the TX510 is combined with Winbond’s 1Gb LPDDR3 DRAM die in a single 14mm x 14mm TFBGA System-in-Package (SiP).
Achieving computing throughput of up to 1.2 TOPS (Tera operations per second), this SiP can perform accurate face recognition (false acceptance ratio of 1 in 10 million) in less than 100ms, and compare features with a library of 100,000 faces in less than 50ms. Peak operating power consumption is just 450mW, and the chip uses just 0.01mW in quiescent mode.
The TX510 is intended for use in applications which require high-speed image detection and recognition, including biometric sensing, video surveillance, smart retail operations, smart home automation and advanced industrial automation.
Winbond’s device offers power-saving features such as Deep Power-Down mode and a Clock Stop capability.