TDK now offers its new ModCap UHP (B25648A) series of DC link capacitors for power electronic applications. ‘UHP’ stands for ‘Ultra-High Performance’, and this series enables continuous operation at hotspot temperatures of up to +105 °C without power derating. Compared to previous ModCap generations, which required derating starting at +90 °C, the new design enables higher current density and a longer lifetime in challenging conditions.

By combining a new high-temperature dielectric with a modular design, the ModCap UHP series extends the lifetime of capacitors to 200,000 hours at +105°C and supports a 20% higher current density. With a DC voltage rating of 1350-1800V and a capacitance ranging from 470 µF to 880µF, the series is optimized for SiC semiconductor-based inverters that require low inductances (ESL of 8nH) and high-frequency performance.

These capacitors target fast-growing sectors, including renewable energy (solar and wind power, electrolyzer), energy storage, and inverters for railway and industrial drives. Their cubic design (205 x 90 x 170 mm; L x W x H) simplifies busbar integration, thereby increasing power density in compact converters and reducing the need for additional snubber capacitors.

Beyond performance, the ModCap UHP advances sustainability and safety. The dielectric film is ISCC-certified bio-circular BOPP, while the housing complies with UL94 V-0 and EN 45545-2 HL3 R23 fire standards. UL recognition is pending.

For ModCap, TDK offers a set of different engineering tools, including a SPICE library, the web-based Capacitor Life and Rating Application (CLARA), and the web-based CAP Thermal for thermal simulation.