At Embedded World 2026 (March 10-12, Nuremberg), SECO will showcase a portfolio of MediaTek–based solutions, reinforcing its partnership and highlighting how their combined technologies enable advanced Edge AI across multiple verticals. SOM-Trizeps-X-Genio360/360P expands SECO’s Trizeps SODIMM System-on-Module family, and is based on the recently launched MediaTek Genio 360 and the pin-to-pin compatible Genio 360P IoT platform.
MediaTek Genio 360/360P are 6nm, value-tier IoT processors designed for cost-sensitive embedded applications, combining strong CPU performance with excellent power efficiency. They integrate an advanced MediaTek NPU delivering over 8 TOPS of AI performance, enabling on-device AI and Generative AI at the edge.
With support for 4K displays, camera interfaces, and rich industrial connectivity, SOM-Trizeps-X-Genio360/360P target advanced HMIs, mobile and handheld devices, smart appliances, and AI-enabled edge systems.
“The launch of our new Genio 360–based SOM reflects the strength of our collaboration with MediaTek, enabling SECO to deliver cost- and power-efficient edge platforms that accelerate time-to-market for on-device AI,” said Davide Catani, Chief Technology & Innovation Officer at SECO.
Also at Embedded World, SECO will show its Modular Vision based on the Genio 700 processor will be showcased through a dedicated live experience presented at both the SECO booth and the MediaTek booth. Real-world medical automation scenarios running entirely at the edge will demonstrate how AI models for face recognition, voice command processing, and sample inspection can operate locally with ultra-low latency. Integrated with Clea, the demo also illustrates secure device management, data visualisation, and lifecycle support within SECO’s end-to-end edge ecosystem.
SECO’s at Embedded World 2026 will be in Hall 1, Booth 320.
