Multiple subsystems onboard the Artemis II core systems, including the Orion capsule and Space Launch System (SLS) rocket, carry Renesas radiation-hardened ICs (as Intersil-branded devices). The devices are used in the space vehicle’s avionics and safety launch system, to regulate and distribute power, maintain signal integrity and support onboard computing. The specialised ICs are built to operate reliably when exposed to the elevated levels of radiation and extreme temperatures that are typical of human space missions.
The NASA’s Artemis II mission is the first manned space endeavour in over fifty years. Four astronauts are now en route to orbit the moon aboard the NASA’s Orion spacecraft, which launched from the Kennedy Space Center in Florida yesterday (April 1, 2026).
“Human space flight missions leave no margin for failure, and we’re proud to be one of the select few semiconductor companies entrusted to provide space-qualified technology for this historic crewed Artemis mission,” said Chris Stephens, Vice President of the HiRel Business Division at Renesas. “Our rad-hard devices help keep spacecraft systems connected, protected and precisely controlled, as crews venture into deep space. We look forward to supporting future landmark missions and ushering in the next era of solar system exploration with our space‑grade semiconductor solutions.”
The Renesas Intersil brand has a long history in the space industry spanning more than six decades, beginning with the founding of Radiation Inc. in 1950. Since then, virtually every satellite, shuttle launch and deep-space exploration mission has included Intersil-branded products. Renesas leverages this experience to deliver efficient, thermally-optimized and highly-reliable SMD, MIL-STD-883 and MIL-PRF 38535 Class-V/Q Intersil-branded products for the defense, high-reliability (Hi-Rel), and rad-hard space markets. Renesas Intersil-brand rad-hard ICs support subsystems for mission critical applications in data communications transfer, power supplies and power conditioning, general protection circuitry, and telemetry, tracking and control (TT&C).
