CEA flagship institutes CEA-Leti and CEA-List are joining their expertise with Powerchip Semiconductor Manufacturing (PSMC) of Taiwan to introduce high-bandwidth communication and high-efficiency computing technologies into PSMC’s established 3D stacking and interposer platforms for next-generation AI solutions. This will consist of RISC-V as well as microLED silicon photonics.
The semiconductor industry faces mounting challenges, including the physical limits of traditional copper interconnects, increasingly stringent power budgets, and the urgent need for flexible, scalable computing architectures. By integrating short-reach, high-bandwidth optical links for energy-efficient data movement and customizable RISC-V processor architectures, the collaboration directly addresses these constraints and establishes a new paradigm in high-performance data transport and computing architecture.
“RISC-V is transforming processor design by combining openness, flexibility, and cost efficiency. Its customizable architecture allows industrial players to develop solutions tailored to their needs. Our joint effort will give customers a customizable compute platform that meets the performance and power targets,” said Olivier Thomas, Deputy Head of the Digital IC Design Division at CEA-List.
Sébastien Dauvé, Chief Executive Officer of CEA-Leti added: “In the collaboration, microLED is a critical enabling technology that will boost optical-communication throughput using low-power GaN LED solutions.”
CEA has a key role in transferring scientific knowledge and innovation from research to industry. This high-level technological research is carried out in particular in electronic and integrated systems, from microscale to nanoscale. It has a wide range of industrial applications in the fields of transport, health, safety and telecommunications, contributing to the creation of high-quality and competitive products.
“This collaboration enriches PSMC’s 3D stacking and interposer technology envelope with high-efficiency RISC-V computing IP and high-bandwidth silicon photonics chiplet communication. By leveraging the expertise of CEA-Leti and CEA-List alongside PSMC’s technologies, we will provide foundry services to customers for next-generation AI applications,” said Dr. Shou-Zen Chang, Chief Technology Officer of PSMC.
