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NXP’s FEIC enables Wi-Fi 6 connectivity in the Honor Magic V smartphone

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NXP Semiconductors’s WLAN7207H 2.4GHz front-end integrated circuit (FEIC) is at the heart of Wi-Fi 6 connectivity in Honor’s flagship Magic V smartphone. The NXP WLAN7207x single FEM family provides routing and PCB design flexibility that optimises RF performance in the smartphone.

“As smartphones have become more feature-rich, form-factor has become a differentiating feature for consumers,” said George Zhao, CEO of Honor. “NXP’s FEM solution enabled us to overcome the increasing complexity and challenges presented by our flagship phone designs, while still offering the longer transmission range and improved signal quality consumers associate with Wi-Fi 6.”

To meet consumer needs, smartphones have become increasingly complex, creating challenges for the architectures and PCB designs. At the same time, consumers do not want to compromise on Bluetooth and Wi-Fi 6 performance, which delivers a number of enhancements over previous generations, including reduced latency and increased network capacity and efficiency. The WLAN7207x single FEM family offers designers more freedom in routing and placement on the PCB, enabling RF optimization that supports higher Wi-Fi 6 and Bluetooth performance.

“As consumers continue to rely on their smartphones for an ever-increasing list of data-driven benefits, Wi-Fi 6 addresses the need to move a rapidly expanding amount of data across more devices,” said Doeco Terpstra, Vice President and General Manager Smart Antenna Solutions, NXP. “Our FEIC solutions enable the Wi-Fi 6 performance benefits that consumers want while offering the design flexibility that OEMs need.”

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