NGK Insulators plans to triple its production capacity for translucent alumina wafers by 2027 to meet the growing demand for chiplet integration, supporting the era of AI and autonomous driving. Through this expansion, the NGK Group aims to establish a stable supply system in the high-performance semiconductor market by fiscal 2030.
With the rapid spread of generative AI, demand for high-performance semiconductors is increasing. The translucent alumina wafers serves as a support wafer used to temporarily hold semiconductor chips during chiplet integration, a technology that combines multiple small semiconductor chips to achieve high performance. As such, the Translucent Alumina Wafer is attracting attention as an essential component in the chiplet integration process of semiconductor manufacturing.
The Translucent Alumina Wafer uses HICERAM, a translucent ceramic material that NGK has developed and refined over many years. In addition to its light-transmitting properties, this material offers high rigidity and durability, significantly reducing warping and breakage during manufacturing—issues commonly seen with conventional glass support wafers. This improvement enhances process stability for customers and contributes to reduced product loss and improved quality.
As part of this capital investment, NGK will enhance the production facilities of its subsidiary NGK CERAMIC DEVICE in Komaki City, the Aichi Prefecture, which is responsible for manufacturing.
