Smiths Inteconnect introduced its new Planar X Series of RF filter solutions with bandpass, bandstop, lowpass and highpass configurations up to 18GHz (Ku Band) for satcom, radar and broadcasting applications. The new series is part of an overarching initiative to develop cutting-edge board-level ceramic-based thick-film RF filters.
The filters’ small footprint, light weight and surface-mountable configuration allow for high-volume pick-and-place productions.
“Planar X Series complements our broad portfolio of RF and microwave components with the latest technology in RF filters, offering premium performance in a small package,” said Paul Harris, Sales and Marketing VP at Smiths Interconnect. “The addition of the planar filter technology is a natural progression to our existing RF filter product portfolio and Smiths Interconnect is excited to offer this capability in combination with value-added testing services.”
With the Planar X Series, Smiths Interconnect leverages existing thick-film process technology upon various dielectric substrates designed for high-reliability environments.
