Connectivity company, Molex, has prepared a product roadmap for delivering the full technology stack needed to address the massive scaling requirements of hyperscale data centres. Molex has expanded its Co-Packaged Optics (CPO) interconnect toolkit designed to eliminate the most critical bottlenecks in AI cluster scaling. It has also introduced the High-Radix Optical Circuit Switch (OCS) Platform to deliver a complete optical switching fabric to meet emerging data requirements. By providing flexible, high-density optical switching, AI infrastructure operators are able to dynamically reconfigure network topologies and maximise utilisation of valuable compute resources.
“The rapid growth of artificial intelligence, from large‑scale model training to real‑time inference, is placing unprecedented demands on data‑centre networks. Our goal is to deliver comprehensive and differentiating optical solutions that support the next generation of AI infrastructure, enabling greater scalability, improved operational efficiency and significantly enhanced energy efficiency as data centre networking demands continue to accelerate,” said Peter Lee, VP and General Manager for the Optical Solutions Business Unit at Molex.
Molex’s VersaBeam EBO backplane connector consolidates up to 192 fibres into a single interface. By moving connectivity to a pre-configured optical backplane, this new product enables “blind” installation of cards and sleds forming optical connections in mass and utilizes Expanded Beam Optical (EBO) technology to reduce sensitivity to dust and debris. The result dramatically reduces cleaning, inspection and maintenance requirements, slashing deployment time by up to 85%.
The VersaBeam EBO backplane connector high-capacity transport can easily be paired with the Teramount TeraVERSE detachable fibre-to-chip interface, to provide a continuous, high-performance optical path. This pairing also enables a modular and swappable architecture that minimises damage to fibre interfaces and the requirement for onsite optical expertise.
“By combining the proven interconnect expertise that Molex brings with Teramount’s breakthrough detachable-fibre and optical-coupling connectivity, we’re enabling hyperscalers to accelerate deployment of flexible, high-performance optical solutions,” said Hesham Taha, Teramount CEO and co-founder.
