Fabless mixed-signal ASICs supplier, EnSilica, will be at MWC Barcelona 2026 from March 2 – 5 in Hall 7, Stand 7B17, exhibiting a complete Ku- and Ka-band chipset for highly integrated, cost-optimised satellite broadband user terminals. Developed using a resilient, predominantly European supply chain, the chipset combines RF, beamforming and digital processing capabilities to reduce power consumption, component count and overall system cost, enabling compact flat-panel antenna terminals across multiple satellite constellations and frequency bands.
“This complete Ku- and Ka-band user terminal chipset builds on our established portfolio of user terminal technologies to deliver highly integrated, power-efficient solutions for next-generation flat-panel terminals. By leveraging a robust European supply chain, we help customers de-risk deployment while achieving best-in-class cost and performance. Samples are available now of many chips,” said Paul Morris, VP RF and Communications Business Unit at EnSilica, commented,Â
Visitors to the stand will also be able to discuss EnSilica’s forward roadmap and explore options for custom ASIC solutions for both satellite payloads and user terminals, targeting further reductions in power, cost and system complexity.
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