Electroninks, provider of metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, unveils its next-generation EMI shielding solution, setting a new standard for cost, performance and reliability in advanced semiconductor packaging.
The new process involves smaller tooling footprint, and boasts a greater than 99% reduction in power and water use compared to conventional PVD and e-less metallization, also making it the most sustainable solution on the market. The solution is based on the company’s revolutionary EI-1200 ink series technology, which is engineered to directly metalize molding compounds, silicon and other relevant substrates in various packaging formats including package level, die-level, and wafer level. However, the major advancements come from the addition of a recon-free process.
Electroninks’s MOD spray process offers major advancements in EMI shielding by enabling uniform sidewall coverage with aspect ratios approaching 100% for a standard 2mm spacing and the process can do recon-free (which depending on spacing and test vehicle design) can achieve up to 70 percent coverage. In both cases, a feat that traditional processes struggle to match. Critically, the ability to achieve sidewall coverage in such geometries enables manufacturers to eliminate the wafer dicing and reconstitution steps that are typically required to achieve sufficient spacing for traditional sputtered films. By bypassing these stages, Electroninks’s MOD process not only simplifies the overall packaging workflow but also boosts production throughput and reduces handling-related defects.
Silver is widely used in EMI shielding due to its excellent conductivity and high-frequency attenuation capabilities. However, it can be susceptible to surface sulfurization that can alter the film’s appearance when exposed to certain environmental conditions such as elevated temperatures, specific air qualities, or high-humidity tests like uHAST. While this tarnish is purely cosmetic and doesn’t affect conductivity or shielding effectiveness, visible discoloration can erode customer trust, raise quality concerns in manufacturing and inspection, and create uncertainty for long-term reliability. Electroninks has worked with customers to develop solutions, such as the modification of its product chemistry or the addition of a black or clear overcoat, to completely eliminate this hurdle. When combined with the recon-free process, this creates the industry’s most advanced EMI shielding solution.
“The semiconductor packaging industry has long relied on sputtered EMI shielding layers, despite their cost and complexity,” said Brett Walker, CEO of Electroninks. “With EI-1207, we’re proving that MOD-based spray coating is not just viable; it’s technically superior, lower cost, more sustainable, and ready for high-volume adoption worldwide.”
At the core of EI-1207’s innovation is Electroninks’s proprietary MOD ink chemistry, a true solution, not a particle suspension, which enables superior film uniformity, low-temperature curing, and stable spray coating with no reconstitution required. The platform is already in use by leading OSATs, with production tool installations underway in both Korea and Taiwan.
