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Electroninks and Merck KGaA, Darmstadt, Germany partner to redefine BSM in semiconductor packaging

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Electroninks, a provider of metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, has teamed up with Merck KGaA, Darmstadt, Germany to develop new Backside Metallization (BSM) solutions for advanced semiconductor packaging. This new deal expands on the existing collaboration for Electroninks’s cost-efficient and highly effective EMI shielding solution.

The new BSM technology provides a better solution to traditional sputtering and plating processes, addressing the reliability, warpage, and increasing thermal management challenges in hybrid bonding, wafer and Panel Level Packaging (PLP) metallization.

As AI chips and high-performance computing devices continue to push the limits of processing power, thermal density has risen significantly, making efficient heat dissipation more critical than ever. Reliable bonding between semiconductor packages and Thermal Interface Materials (TIM) is essential for effective heat transfer. However, conventional BSM methods—such as sputtering and plating—pose challenges related to cost, equipment requirements, scaling at larger panels, and environmental impact.

By leveraging Merck KGaA, Darmstadt, Germany’s expertise in semiconductor coating processes and Electroninks’s Metal-Organic Decomposition (MOD) Ink technology, this collaboration aims to redefine the standards for BSM in advanced semiconductor packaging.

Merck KGaA, Darmstadt, Germany and Electroninks remain committed to advancing their strategy and commercial offerings in advanced packaging. With the commercialization of this pioneering BSM technology, which is now underway at customer sites globally,  they aim to contribute to the advancement of high-efficiency, more sustainable semiconductor packaging solutions on silicon wafer, as well as panel level processing where limited solutions exist today.

The companies plan to develop and market this technology together to customers in the near future, with on-site technical support in the US and APAC.

Find out more at www.electroninks.com

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