On-device AI semiconductor solutions supplier DEEPX’s DX-M1 AI Booster is powering the RZ/G3E DX-M1 system on module (SoM) from Sweden’s Virtium Embedded Artists, which recently won the “Best in Show” award at Embedded World North America 2025 .
The module combines a Renesas RZ/G3E processor with the DEEPX DX-M1 AI accelerator, delivering up to 25 TOPS of AI performance while consuming less than 5 watts of power. It is widely recognized as a new benchmark for edge AI applications such as industrial robotics, smart manufacturing, and vision systems.
The Renesas RZ/G3E SoM integrates seamlessly with the DEEPX DX-M1 over a PCIe Gen3 interface, providing optimal power efficiency and scalability for next-generation embedded AI designs.
The NXP i.MX SoM + DX-M1 combination achieves up to 25 TOPS (200 eTOPS/INT8) performance within a compact form factor, making it ideal for smart cameras, robotics, and industrial controllers that require powerful yet efficient on-device AI.
Virtium’s modular SoM architecture allows customers to easily add the DEEPX DX-M1 without redesigning hardware, enabling a smooth and cost-efficient transition to AI-powered products across Europe’s embedded computing market.
The flagship DEEPX DX-M1 AI accelerator delivers GPU-class performance under 5W of power consumption, optimized for fanless and space-constrained systems. DEEPX’s proprietary DXNN compiler and Drop & Play SDK enable seamless integration of complex AI vision models directly into existing SoM architectures, dramatically improving development efficiency and reducing time to market.
Building on its expanding partner network, DEEPX is deepening co-development and mass-production collaborations with European SoM companies. The company aims to lead the Physical AI era, in which AI semiconductors act as the core infrastructure driving transformation in industries such as automation, robotics, smart cities, and machine vision.
