News Kioxia is sampling its UFS 5.0 embedded Flash memory to customers developing generative AI applications on battery-powered devices 24th February 2026
News Renesas develops low power ternary content-addressable memory built on a 3nm FinFET process 18th February 2026
Feature Planning for the accelerating trend of component obsolescence in 2026 and beyond 12th February 2026
News New chip from Fraunhofer Institute for Photonic Microsystems makes pH measurements easier 12th February 2026
Products A new line of Ethernet-APL compatible switches from Omnitron are suitable for industrial process automation 9th February 2026
News EnSilica to highlight a complete Ku- and Ka-band user terminal chipset at MWC Barcelona 2026 6th February 2026
Products Gaia Converter will bring its innovations in power system reliability at Embedded World 2026 6th February 2026
Products Toshiba introduces two sine-wave drive controllers for three-phase BLDC motors 4th February 2026
Products Samtec will show its 224Gbps and 448Gbps high-performance interconnect solutions at DesignCon 2026 4th February 2026
Kioxia is sampling its UFS 5.0 embedded Flash memory to customers developing generative AI applications on battery-powered devices 24th February 2026
Renesas develops low power ternary content-addressable memory built on a 3nm FinFET process 18th February 2026
New chip from Fraunhofer Institute for Photonic Microsystems makes pH measurements easier 12th February 2026
A new line of Ethernet-APL compatible switches from Omnitron are suitable for industrial process automation 9th February 2026
EnSilica to highlight a complete Ku- and Ka-band user terminal chipset at MWC Barcelona 2026 6th February 2026
Gaia Converter will bring its innovations in power system reliability at Embedded World 2026 6th February 2026
Samtec will show its 224Gbps and 448Gbps high-performance interconnect solutions at DesignCon 2026 4th February 2026
