Connectivity company, Molex, invests in CAEPlus to advance thermal management with active liquid cooling solutions for AI data centres. CAEPlus has a platform called BoundaryCool that harnesses a compact, active cooling architecture suitable for the cooling of high-performance devices.
“Advanced thermal management is becoming a critical enabler for the next wave of compute performance. Our strategic investment in CAEPlus reflects our commitment to supporting innovations in liquid cooling while working with emerging technology leaders to help customers address rapidly evolving AI and compute-intensive data centre requirements,” said Jairo Guerrero, VP and GM, Copper Solutions Business at Molex.
The strategic collaboration will support continued advancements across the BoundaryCool platform, engineered to deliver significantly higher heat transfer performance and greater reductions in CPU/GPU/TPU chip temperatures compared to passive cold plate solutions while remaining compatible with legacy data centre architectures.
The addition of CAEPlus technology to Molex’s comprehensive thermal management portfolio offers data centre customers a broader range of solutions engineered to address the most demanding computing requirements. As part of the agreement, Molex retains exclusive licensing to apply CAEPlus technology to the Molex portfolio of pluggable I/O solutions. Financial terms of the investment were not disclosed.
