Enclustra, the Swiss-based FPGAs innovator launched its new Physical AI Technology Line, as a result of its strategic partnership with SiMa.ai and their joint introduction of the 50 TOPS Modalix System-on-Module (MLSoC ). The devices will address the growing demand for multi-modal AI, Physical AI, and Generative AI applications at the edge.
“Enclustra is committed to pushing the boundaries of FPGA and SoM innovation. This launch strengthens our ability to deliver Edge AI solutions that empower industries to scale AI adoption efficiently,” said Philipp Baechtold, CEO of Enclustra.
The Modalix SoM provides a high-performance, energy-efficient solution that enables organisations in manufacturing, robotics, industrial automation, aerospace, and defence to integrate advanced AI capabilities faster, more reliably, and at scale.
Its benefits include seamless integration and flexibility – compact design with extensive I/O options ensures compatibility with GPU-based SoMs and existing architectures; the SiMa.ai’s ONE platform for Physical AI, including the Palette and Palette Edgematic software suites, streamlines development with Python, PyTorch, and OpenCV; and advanced thermal management and performance monitoring ensure dependable operation across industries with demanding requirements.
“The introduction of our Modalix SoM represents a critical expansion into Physical AI, addressing the diverse needs of robotics, automation, and autonomous systems. Together with Enclustra, we are removing integration barriers and making it remarkably simple for companies worldwide to upgrade from legacy systems to Modalix’s superior performance,” said Krishna Rangasayee, CEO and Founder of SiMa.ai.
Engineering samples of the MLSoC Modalix SoM are available now through Enclustra’s exclusive Early Access Program. Customers can order today.
