Versarien developed a standard range of heat sink products based on its VersarienCu copper foam technology, designed for passive cooling applications where space is at a premium and performance crucial.
The VersarienCu heat sinks can cool any IC, in applications such as power, high-temperature environments, set-top boxes, AP routers, modems, optical networks and LED TV and flat panel displays and others.
VersarienCu reduces the potential size requirement of individual components due to increased thermal efficiency, as the metallic foam now allows for a reduced footprint. The increased thermal efficiency of the copper foam on the component can allow for a cooling fan to be removed from products, and has the additional major benefit of increasing the life of a component by reducing overheating.
The products are available off-the-shelf from Versarien.