Advanced heat transfer technology will be on show by leading thermal management solutions company Thermacore Europe Ltd at the International Microelectronics Assembly and Packaging Society’s (IMAPS) workshop on micropackaging and thermal management in La Rochelle, France (4–5 February).
Thermacore’s k-Core features encapsulated Annealed Pyrolytic Graphite (APG) to provide rapid, reliable and effective high-conductivity thermal spreading for a wide range of heat transfer and cooling applications in the aerospace, transportation and defence sectors.
Samples of the technology, which provides up to three times the conductivity (k) of solid copper with lower mass than aluminium, will feature as the centrepiece of the company’s presence at IMAPS where Mark Small, Thermacore’s area sales manager, will be presenting a paper to delegates on APGs.
He said: “With ever increasing global electronics’ power and miniaturisation, IMAPS provides an ideal platform to demonstrate directly the advantages and benefits of our k-Core technology to customers who require advanced generation heat transfer solutions.”
With its state-of-the-art ISO-certified manufacturing facility in Northumberland, UK, Thermacore Europe Ltd is able to provide diverse technologies which include intelligent thermal management systems (ITMS), heat spreaders, heat pipe assemblies and liquid cooling systems alongside material development and testing programmes. More at www.thermacore.com