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NXP, ING and Samsung test world’s first UWB-based peer-to-peer payment application

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NXP Semiconductors has joiined forces with ING Bank and Samsung to trial the industry’s first UWB-based peer-to-peer payment application. The pilot program called on Project NEAR will use UWB-enabled Samsung Galaxy smartphones to allow consumers to directly share money with peers.

The ultra-wideband capabilities are provided by NXP’s Trimension SR100T technology.

“With this new technology, consumers no longer need to share personal details, which makes mobile payments even more swift and easy,” said Thijs Janssen of ING Factory, ING’s department that innovates in co-creation with corporates. “UWB’s precision location capabilities ensure that the payment is safely transferred to the right person.

“By using NXP’s Trimension SR100T UWB chips to enable consumers to pay directly through the ING banking app, we’re enabling all the convenience of peer-to-peer payments, while also creating the opportunity to expand to new use cases in the future, such as adding UWB to point of sales to enable a secure, hands-free checkout experience,” said Rafael Sotomayor, Executive Vice President and General Manager, Connectivity & Security at NXP. “As the need for convenient peer-to-peer payments continues to grow, our collaboration with ING and Samsung helps to make this innovative payment method suitable for worldwide adoption.”

“UWB technology is opening up a whole new world of connectivity, one where our devices and appliances can all communicate seamlessly with each other in an open ecosystem,” says JM Choi, Corporate Vice President and Head of Connectivity R&D Group at Mobile Experience Business, Samsung Electronics. “By working closely with partners like NXP and ING, we’re able to put this game-changing technology into the hands of even more consumers, creating innovative new experiences that make people’s everyday lives easier.”

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