One-Part Liqui-Form 2000 From Bergquist Offers High Thermal Conductivity

Bergquist introduced the Liqui-Form 2000, its first product in a new ‘Liqui-Form’ product line. Liqui-Form 2000 is a highly conformable shear-thinning material which requires no curing, mixing or refrigeration; the product’s formulation delivers excellent thermal performance, low applied stress and a reliable long-term performance for the most demanding applications.

Liqui-Form 2000 is thixotropic and has a natural tack to ensure it forms around the components and stays in place in the application. Unlike traditional pre-cured gap filling materials, a liquid approach offers infinite thickness options. It also eliminates the need for specific pad thicknesses or die-cut shapes for individual applications. Precise amounts of Liqui-Form 2000 can be applied directly to the target surface, resulting in less waste and a more effective use of the material.
During extensive laboratory testing, Liqui-Form 2000 provided consistent and reliable thermal performance. This gap filling material is ideal for fragile assemblies or for filling intricate air gaps between electrical components.


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