OMC, the pioneer in optoelectronics, including LED lighting, backlighting and industrial fibre optic transmission components, has introduced its ClearSource range of solid-state emitters that use a new die bonding technique to connect the LED chip electronically to the leadframe, eliminating ‘dark spots’ and improving beam precision.
Standard LED optical sensors use a top-mounting wire bond to connect the LED chip to the anode or cathode. The bond wire obstructs the light output, giving rise to dark spots and patches in the beam which makes precise sensing and detection more difficult. In the new ClearSource series, the wire is bonded to the side of the chip, leaving the output beam unobstructed. This produces a very well-defined light beam which enables high-accuracy sensing and detection. For even greater precision measurements that require near-parallel light emission, lenses can be incorporated. Additionally, this die-bond configuration reduces capacitive effects within the diode, enhancing switching speed and reliability.
Optoelectronic Manufacturing Corporation