AVX Corporation introduced a new series of low profile, best in class 0805 MLO diplexers. Based on its patented multilayer, organic, high-density interconnect technology, AVX’s new MLO diplexers incorporate high dielectric constant and low-loss materials to realize high Q printed passive elements, such as inductors and capacitors in multilayer stackups.
Featuring low insertion losses, low parasitics, a low profile (< 0.6mm) and excellent solderability, the new 0805 Series diplexers support several wireless standards, including WCDMA, CDMA, WLAN, and GSM, and are ideally suited for band switching in dual and multiband systems.
AVX’s 0805 Series diplexers measure 2.12mm x 1.28mm x 0.55mm (0.083” x 0.050” x 0.021”), are rated for use in temperatures ranging from -40°C to +85°C, feature a maximum power capacity of 4.5W and are expansion-matched to most PCB materials.
Available in four frequencies and two terminations (Au and Ni/Sn), AVX’s 0805 Series diplexers feature standard tape and reel packaging.