Thermal Management
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Orion Fans's 3-point program
Dallas-based Orion Fans, a division of Knight Electronics and a manufacturer of standard and custom AC and DC fans, has developed a three-point program to support both new and existing customers' cooling needs. Maintaining the largest available inventory
Vicor introduces offline VI Brick BCM array with vertical mount heatsink
AThe Brick Business Unit of Vicor Corporation has announced the introduction of the VI Brick BCM Array. This is a high-efficiency (typically 95%), high power (up to 650W), vertically mounted BCM array, that provides isolation and conversion fromRaheama carbon-fiber filler offers high thermal conductivity
Expectations are heating up for a new thermal-management material that Japan's Teijin Limited hopes to launch in the foreseeable future. Called Raheama, the material is a carbon fiber filler that conducts heat better than metals such as silver
National and Nuventix introduce new reference design for LED bulbs
National Semiconductor and Nuventix, Inc. today unveiled a new electronic drive and thermal management reference design that simplifies development of high-brightness light-emitting diode (LED) bulb fixtures that replace incandescent or compact fluorescent light bulbs in standard sockets.
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Nextreme breaks temperature barrier with the OptoCooler HV14
Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced that the OptoCooler HV14 is the industry's first high voltage, low current thin-film thermoelectric cooler (TEC) targeted at laser diode
New T-CLAD with pre-applied thermal interface material accelerates assembly process
Bergquist has introduced its T-CLAD Metal-Core PCB circuits pre-applied with Bond-Ply 450 adhesive tape. The reflow-resistant thermal interface tape saves product manufacturers from manually applying thermal interface material after assembly. This streamlines production, allowing to quickly bond the
Nextreme ships high voltage OptoCooler
Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced the first customer shipment of the new OptoCooler HV14 thermoelectric cooler, the first module in a new class of
“Plug-and-play” power LED thermal substrates pre-solve lighting design challenges
To shorten time to market for LED-based illuminations in lighting-industry form factors, the Bergquist Company has introduced ready-to-use Thermal-Clad insulated metal substrates (IMS) in standard star, square, array or strip formats. Ten different contact patterns are available, supporting
Nextreme gets the lead out with RoHS compliance
Nextreme Thermal Solutions, a specialist in microscale thermal and power management products for the electronics industry, has announced that future thermoelectric products will be manufactured using RoHS-compliant assembly methods. The company has developed non-lead-based solder processes for use in the manufacturing
New OPTEK DVD Highlights Solutions To The Complexities of VLED Thermal Management
Providing solid state lighting design engineers with a complete technical reference on LED construction, performance and thermal management, TT electronics OPTEK Technology has developed a DVD that presents detailed information about visible LED technology. The DVD examines the