Semiconductors
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RFMD announces major Gallium Nitride (GaN) milestone
RF Micro Devices, a designer and manufacturer of high-performance semiconductor components, today announced that RFMD has qualified and released the RF3931, a 48-volt, 30-watt gallium nitride (GaN) unmatched transistor optimized for high power commercial and defense applications. The
New BGA switch-a-pitch adapters from Aries now adapt 0.50mm devices to 1.00mm boards
Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, recently added new BGA Switch-A-Pitch Adapters that adapt to pitch bottoms lower than previous models, expanding this unique product line that economically facilitates the use of
AGIGA Tech announces new CAPRI family
AGIGA Tech Inc, a subsidiary of Cypress Semiconductor Corp, today introduced the market's highest-density, high-speed non-volatile RAM system. The AGIGARAM(tm) non-volatile system's (NVS) new CAPRI family delivers densities between 256 megabytes (2048 megabits) and 2 gigabytes (16 gigabits).
ROHM Semiconductor establishes European Design Centre
ROHM Semiconductor announced the creation of a new European Design Centre (EUDC) which aims to provide dedicated products, project management and design-in support to customers in Europe. The EUDC is located in Wilich-Münchheide and started operations from 1st
Sonoscan gives details of stacked die tool
Sonoscan has unveiled some of the details that enable its powerful new software tool to perform acoustic imaging to identify anomalies and defects in stacked die configurations. The software, announced in August, is already being used in the
Fully integrated power line modem for smart meters
ON Semiconductor has introduced the AMIS-49587, the latest member of the company's power line carrier (PLC) modem family. The AMIS-49587 provides a highly integrated, standard compliant, low power PLC solution for use in applications such as smart electric
Scottish Semiconductor Supplier Forum merges with National Microelectronics Institute
Scottish Semiconductor Supplier Forum merges with National Microelectronics Institute The National Microelectronics Institute (NMI) and the Scottish Semiconductor Supplier Forum (SSSF) have announced that the boards of both trade associations have agreed to a merger. The move sees
Sonoscan offers an effective acoustic microscope imaging of stacked die
Sonoscan has announced that its SonoLab division is offering a new service that provides greatly enhanced acoustic microscope imaging of stacked die assemblies.
The new service, available immediately, uses Sonoscan's proprietary software developed over the last two years.
Chip market shows 18% growth
Following hot on the heels of April's 16% month-on-month sales growth, May grew a further 0.9% sequentially, putting June on track to break through the US$20bn barrier, for the first time since the chip market collapsed last September.TSMC joins the CEA-Leti program on multiple e-beam lithography for IC manufacturing
TSMC signed an agreement today in which TSMC will join the new industrial program IMAGINE, led by CEA-Leti, on maskless lithography for IC manufacturing. Intended to operate for three years, this program allows companies to assess a maskless
