Chipsets
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DS2 to develop G.hn standard compatible chipset following ITU-T ruling
DS2, a supplier of high-speed powerline communications technology, today welcomed the ITU-T's decision to agree on a new international standard for high-speed transmission over power lines, phone lines and coaxial cables by announcing that it is working to introduce
ST-NXP Wireless brings 3G/UMA to mass market
ST-NXP Wireless has announced the world's first 3G unlicensed mobile access (UMA) chipset platform is now in mass production, paving the way for a new range of converged fixed and mobile phones with enhanced multimedia capabilities. The Cellular
Chip market has entered its eleventh industry recession, says Future Horizons’ Chairman
Despite the fact the first half of 2008 was stronger than many predicted, the relentless deterioration in the global financial markets has finally tipped the global economy into recession. Not surprisingly, it has taken the chip market with
Qualcomm doubles computing power of Snapdragon with new dual-CPU, single-chip solution
Qualcomm, the developer of wireless technologies and data solutions, has today announced a new dual-CPU Snapdragon single-chip solution that is said to extend the reach of the Snapdragon platform by targeting more advanced mobile computing devices.
Beceem and Rohde & Schwarz team up on a turnkey test solution for Mobile WiMAX chipsets
Rohde & Schwarz and Beceem Communications have collaborated to provide a custom test solution for Beceem's mobile WiMAX chipsets. Based on the award-winning R&S CMW270 WiMAX communication tester, this turnkey solution enables Beceem's customers to develop and test
LSI Tarari T2000 10G Content Processor Breaks One Watt Per Gigabit per second Barrier
LSI Corporation has today announced the LSI Tarari T2000 series of silicon-based content processing solutions for high-speed networking applications. The T2000 offers 10 gigabit per second (Gb/s) performance on a single chip, breaking the one watt per Gb/sAtmel’s 6-channel touch controller with integral LED driver adds reliability and cuts component count
Atmel Corporation has announced the AT42QT1060, a touch control chip that integrates 6 channels of touch sensing with the ability to drive up to 7 low current LEDs directly through a pulse width modulated (PWM) output function. TheDiBcom launches very low power mobile TV receivers
DiBcom, a provider of Mobile TV solutions, has announced two new products, the DIB9090 and DIB8090 which both support very low power mobile TV reception of DVB-T and ISDB-T 13SEG signals respectively. The chips also support the receptionAMD supports the UGM Consortium
Kontron has announced that AMD will support the "Universal Graphics Module" standard (UGM). As a leading vendor of the well known ATI computer graphics processing technologies, AMD's support for the UGM standard will accelerate its rapid and wide-spread25V DirectFET chipset optimized for high frequency, high efficiency DC-DC applications
International Rectifier has introduced a 25V synchronous buck converter DirectFET MOSFET chipset for point-of-load (POL) converter designs.The new 25V chipset combines IR's latest generation HEXFET MOSFET silicon and benchmark DirectFET packaging technology to deliver a high density,




