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Plextek launches customisable core processor module for automotive (News)
Plextek, the Cambridge-based electronics and communications design consultancy, today launched its customisable core processor module. The module, combining a robust hardware platform, Microsoft WinCE 6.0 R2 operating system and comprehensive Board Support Package (BSP), is designed to provideR109 software development kit dramatically reduces development time for feature rich stereo headsets (News)
CSR announced the launch of its latest software development kit (SDK), that will allow manufacturers to create a feature-rich stereo Bluetooth headset within a short development time. CSR's Stereo R109 SDK release includes support for CSR's innovative ProximityTektronix delivers audio bus and power analysis solutions for the embedded design engineer (News)
Tektronix, a worldwide provider of test, measurement and monitoring instrumentation, today announced the industry's first triggering and analysis module for digital audio serial buses and a new power analysis module - both new modules complement the MSO/DPO4000 Series
NEC Electronics Announces the World's First Single-Chip LSI for Blu-ray Disc Players (News)
NEC Electronics has announced that it had developed the world's first single-chip LSI to integrate the main functions of Blu-ray Disc players. Sample shipments of the new LSI, named EMMA 3PF, will begin in September 2008.The EMMA
Peregrine low-frequency passive mixer targets UHF-900MHz applications (News)
Peregrine Semiconductor Corporation today announced the release of its newest UltraCMOS RFIC, the 50-ohm PE4150 quad MOSFET core device, ideal for mixer designs requiring low conversion loss and high linearity such as portable radios operating in bands fromRF power DC-DC converter one of smallest power management solutions for W-CDMA/CDMA RFPAs (News)
Fairchild Semiconductor provides the industry's smallest power management solution for the designers of 3G handsets and wireless datacards. The FAN5902, RF Power DC-to-DC converter, is packaged in a 12 bump, 0.5mm pitch CSP package and operates at 6MHz
JDSU to highlight key optical communications technology at OFC/NFOEC 2009 (News)
JDSU announced that it will highlight solutions from its optical communications and communications test and measurement portfolios at the Optical Fiber Communication Conference/National Fiber Optics Engineers Conference (OFC/NFOEC) in San Diego, California from March 22 - 26. Conference




