11 February 2011
CEVA, us-based licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Alango Technologies, developer and licensor of front-end DSP technologies for voice communication and mobile audio, announced the availability of the latest Alango voice processing software package for CEVA’s market-leading CEVA-TeakLite-III family of DSPs.
Addressing the demand for tighter integration and cost reduction in mobile handset design, the CEVA-TeakLite-III DSP enables the integration of wireless baseband processing with mobile audio, speech, and front-end voice enhancement processing functions offered by Alango, on a single core.
The increased consumer and operator demand for clearer, less distorted voice transmissions in noisy environments has seen the introduction of multiple microphone, beam-forming and noise reduction techniques to wireless and wired communication devices. The Voice Communication Package of front-end voice enhancement technologies developed by Alango includes the patent-pending Adaptive Dual Microphone (ADM) algorithm, setting a new standard in noise attenuation by using two omni-directional microphones to significantly reduce background noise, wind and other interference in varying environments, while fully preserving the signal quality.
“Specifically architected for high quality audio and voice processing, the CEVA-TeakLite-III is ideally suited to implement our Voice Communication Package of front-end processing technologies. The high-performance, low-power nature of the DSP and its robust development environment allows our customers to seamlessly enhance their CEVA-based processor designs with our market-leading voice and audio enhancement software and leverage the combined benefits in a cost-efficient manner,” said Dr. Alexander Goldin, CEO of Alango.
“Alango has some highly innovative and practical solutions to voice and audio challenges that many of our customers face. Their dual microphone beam-forming technology has proven itself to result in significant quality enhancements that expand the capabilities and utility of voice and audio products. The entire Voice Communication Package is an ideal complement to our CEVA-TeakLite-III DSP family for high-end voice and audio applications in the handset and automotive markets,” said Eran Briman, vice president of marketing at CEVA.
Other voice and audio enhancement capabilities in the Alango package available for the CEVA-TeakLite-III include software modules for acoustic echo cancelation and feedback reduction, automatic noise dependent speaker volume and equalization, wind noise reduction, dynamic range compression, single-channel noise suppression, EasyListen technology slowing down speech in real time and packet loss concealment. The package natively supports High Definition (HD) voice thus enabling seamless transition to HD enabled mobile handsets and other communication devices.
The CEVA-TeakLite-III architecture, which has been named the industry 'best all around audio processor' in an independent report^^, offers several configurations, including the recently announced CEVA-TL3211, a 32-bit audio DSP running at 1GHz with a silicon footprint of only 0.2mm^2 when implemented on a 40nm process node. The architecture allows an efficient integration of baseband processing along with application processing related needs, such as those provided by Alango.
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