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1. Transonics extends range of Eon High Security Flash Memory

2. ONFI Introduces New 2.3 Specification With ECC Offload Functionality

3. Samsung and Toshiba to Support New Standardized NAND Memory Specification

4. LSI and Seagate Co-develop Technology for Next-Generation High-Capacity Hard Disk Drives

5. Apacer rolls out the new DDR3 LRDIMM

6. ON Semiconductor expands serial EEPROM portfolio

7. ACAL Technology samples Low Latency DRAMs from GSI Technology

8. Apacer Military Standard-Compliant Memory Module

9. Cypress Introduces High Density FIFO Memories

10. New family of low-power, precision temperature sensors targeted at DDR2 and DDR3 memory modules

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